APL 2008 Abstract
Contact Resistance Study of Noble Metals and Alloys Films Using a SPM Test Station
The proper selection of electrical contact materials is one of the critical steps in designing a metal contact microelectromechanical system
(MEMS) switch. Ideally, the contact should have both very low contact resistance and high wear resistance. Unfortunately this combination
cannot be easily achieved with the contact materials currently used in macro-switches because the available contact force in micro-switches
is generally insufficient (less than 1mN) to break through nonconductive surface layers. As a step in the materials selection process, three
noble metals, platinum (Pt), rhodium (Rh), ruthenium (Ru), and their alloys with gold (Au) were deposited as thin films on silicon (Si) substrates. The contact resistances of these materials and their evolution with cycling were measured using a specially developed Scanning Probe Microscope (SPM) test station. These results were then compared to measurements of material hardness and resistivity.
The initial contact resistances of the noble metals alloyed with Au are roughly proportional to their resistivities. Measurements of contact
resistance during cycling of different metal films were made under a contact force of 200–250µN in a room air environment. It was found
that the contact resistance increases with cycling for alloy films with a low concentration of gold due to the build up of contamination on
the contact. However for alloy films with a high gold content, the contact resistance increase due to contamination is insignificant up to
10^8 cycles. These observations suggest that Rh, Ru, and Pt and their gold alloys of low gold content are prone to contamination failure
as contact materials in MEMS switches.
L. Chen, Z.J. Guo, N.E. McGruer, H. Lee, K.W. Gilbert, S. Mall , K.D. Leedy, and G.G. Adams